The objective of this work package was to exchange knowledge and provide key information relating CLIC high precision assemblies between CLIC, Mectalent Oy and Loval Oy. The information exchange benefitted all parties involved in the exchange by increasing the understanding of the requirements and of the possibilities of high accuracy assembly techniques.
Researchers from Mectalent and Loval were integrated in CERN’s RF structure production team in charge of manufacturing the X-band RF structures for the CLIC study. The researchers took part in the actual development and design work done for the CLIC RF components and two-beam module. The work consisted of design work related to high accuracy component assembly and alignment in the CLIC module. The work also included the detailed definition of all assembly processes from cleaning to high power tests, including assembly procedure of the different parts – industrialisation of the assembly process and corresponding mass production.
The work package was shared with two companies, specialists from Mectalent Oy and Loval Oy (FI) joined CLIC RF production team for 18 months in 2013 and 2014. They were participating the assembly work of CLIC two-beam test module and RF structures.